(footprint "DFN-8-1EP_4x4mm_P0.8mm_EP2.7x3.5mm_ThermalVias" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5EA4BE0B)
  (descr "8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "DFN 0.8")
  (attr smd)
  (fp_text reference "REF**" (at 0 -3.075) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 319a971f-6a38-4502-b5f8-8740d47abdab)
  )
  (fp_text value "DFN-8-1EP_4x4mm_P0.8mm_EP2.7x3.5mm_ThermalVias" (at 0 3.075) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 13dd27b8-0d3f-434d-b873-326c4d191daa)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 1be7f8b1-191d-41de-bd77-f033a2ed41c7)
  )
  (fp_line (start 0 -2.15) (end 2 -2.15) (layer "F.SilkS") (width 0.15) (tstamp 3afd232f-f52a-4053-8476-c55f8700d3b1))
  (fp_line (start -2 2.15) (end 2 2.15) (layer "F.SilkS") (width 0.15) (tstamp e572833a-cec3-445b-95e9-0d05a9cc777e))
  (fp_line (start -2.65 -2.35) (end -2.65 2.35) (layer "F.CrtYd") (width 0.05) (tstamp 2d6335ac-9667-4e97-812e-4b09a105e697))
  (fp_line (start -2.65 -2.35) (end 2.65 -2.35) (layer "F.CrtYd") (width 0.05) (tstamp 7ee21a0e-f5b0-4d7a-aa7b-9b1d22f6ff46))
  (fp_line (start 2.65 -2.35) (end 2.65 2.35) (layer "F.CrtYd") (width 0.05) (tstamp b32003c8-4a9a-4cde-a5ee-e85eafc6d7df))
  (fp_line (start -2.65 2.35) (end 2.65 2.35) (layer "F.CrtYd") (width 0.05) (tstamp f2dc598c-b75b-4fcf-85eb-e1cac1bcbc5f))
  (fp_line (start 2 -2) (end 2 2) (layer "F.Fab") (width 0.15) (tstamp 6ca95b7d-e8fd-4150-a663-d379d4a10a52))
  (fp_line (start -2 -1) (end -1 -2) (layer "F.Fab") (width 0.15) (tstamp 960e627e-2cf6-44c6-b6fa-1feb1b517943))
  (fp_line (start -1 -2) (end 2 -2) (layer "F.Fab") (width 0.15) (tstamp bde0b50e-6d8d-4a7a-b229-deab8024a70b))
  (fp_line (start 2 2) (end -2 2) (layer "F.Fab") (width 0.15) (tstamp ca05dbb5-58ca-4016-a86e-66d8d4e50f56))
  (fp_line (start -2 2) (end -2 -1) (layer "F.Fab") (width 0.15) (tstamp ee0dfc53-ad64-4193-8f9d-725c82190881))
  (pad "" smd rect (at -0.625 1.2) (size 1 1) (layers "F.Paste") (tstamp 0b33110b-404f-4f5b-9687-0883d3097c00))
  (pad "" smd rect (at 0.625 -1.2) (size 1 1) (layers "F.Paste") (tstamp 392b5f8d-76ac-4539-89ed-d3ccbbb4dc65))
  (pad "" smd rect (at -0.625 0) (size 1 1) (layers "F.Paste") (tstamp 6fe7c12d-254a-4906-b768-0b5b827c4c53))
  (pad "" smd rect (at 0.625 1.2) (size 1 1) (layers "F.Paste") (tstamp ad456acb-a53c-4605-8bc1-55f7ed345967))
  (pad "" smd rect (at -0.625 -1.2) (size 1 1) (layers "F.Paste") (tstamp b759b1c9-68fd-45ab-8e6b-d5accc8375d4))
  (pad "" smd rect (at 0.625 0) (size 1 1) (layers "F.Paste") (tstamp eb868418-213e-4b72-ad76-decab78b723b))
  (pad "1" smd rect (at -2 -1.2) (size 0.75 0.35) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 2f40782a-5323-40f7-850c-ab311043ac2d))
  (pad "2" smd rect (at -2 -0.4) (size 0.75 0.35) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a8557c87-e137-44f8-aef7-17f5070fc5c8))
  (pad "3" smd rect (at -2 0.4) (size 0.75 0.35) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 658c8268-c57f-4d8c-a991-1bb8e64cc16c))
  (pad "4" smd rect (at -2 1.2) (size 0.75 0.35) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 49a4e304-e486-4a69-9ffb-77f805d11320))
  (pad "5" smd rect (at 2 1.2) (size 0.75 0.35) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp f53e0636-9ada-4621-9ab4-1d832e71a7d7))
  (pad "6" smd rect (at 2 0.4) (size 0.75 0.35) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 14b40488-5cb3-40b4-9c92-8e0b32a73e79))
  (pad "7" smd rect (at 2 -0.4) (size 0.75 0.35) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c257e97f-f6b6-4dab-9bb5-f7fc09e01597))
  (pad "8" smd rect (at 2 -1.2) (size 0.75 0.35) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 2989ae1c-c7c9-483a-a280-55addb05d665))
  (pad "9" thru_hole circle (at 1 -1.2) (size 0.5 0.5) (drill 0.3) (layers *.Cu) (tstamp 0061eac6-76f9-49f1-8a05-5dfb02e7ae48))
  (pad "9" smd rect (at 0 0) (size 2.7 3.5) (layers "B.Cu") (tstamp 0570f36b-8dfb-4d50-8189-1e5bf8f29b8e))
  (pad "9" thru_hole circle (at 1 1.2) (size 0.5 0.5) (drill 0.3) (layers *.Cu) (tstamp 5de91ac4-c051-4c0f-877c-d449468b6241))
  (pad "9" thru_hole circle (at -1 0.4) (size 0.5 0.5) (drill 0.3) (layers *.Cu) (tstamp 6768d169-2e2c-475f-aa36-5a7b91e7ac18))
  (pad "9" thru_hole circle (at 0 -0.4) (size 0.5 0.5) (drill 0.3) (layers *.Cu) (tstamp 703169a8-1cdd-4fc9-a70c-9b384078d8da))
  (pad "9" thru_hole circle (at 0 1.2) (size 0.5 0.5) (drill 0.3) (layers *.Cu) (tstamp a08fcd41-eff5-49a8-83fc-8a0078980c06))
  (pad "9" thru_hole circle (at 0 0.4) (size 0.5 0.5) (drill 0.3) (layers *.Cu) (tstamp a2d759b2-fe1d-4b45-9299-c4dd5f86afee))
  (pad "9" thru_hole circle (at 1 0.4) (size 0.5 0.5) (drill 0.3) (layers *.Cu) (tstamp a3d98522-9ddc-4a60-882a-1027a016302b))
  (pad "9" thru_hole circle (at 0 -1.2) (size 0.5 0.5) (drill 0.3) (layers *.Cu) (tstamp aa3dd26e-11b5-4568-a950-f2747088e8cd))
  (pad "9" smd rect (at 0 0) (size 2.7 3.5) (layers "F.Cu" "F.Mask") (tstamp bc46ff12-75f6-4f8b-8e78-839a102cc770))
  (pad "9" thru_hole circle (at -1 -1.2) (size 0.5 0.5) (drill 0.3) (layers *.Cu) (tstamp bff1b0bd-34cc-4077-98dd-e83129b9c645))
  (pad "9" thru_hole circle (at -1 -0.4) (size 0.5 0.5) (drill 0.3) (layers *.Cu) (tstamp e0d8893a-6ce4-4c1f-aa99-76eb6a975aac))
  (pad "9" thru_hole circle (at -1 1.2) (size 0.5 0.5) (drill 0.3) (layers *.Cu) (tstamp e6c8a72a-f093-495c-ae3e-9e60b4c924a6))
  (pad "9" thru_hole circle (at 1 -0.4) (size 0.5 0.5) (drill 0.3) (layers *.Cu) (tstamp f07b250b-adb2-4122-a1bf-5ed64566ecbb))
  (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/DFN-8-1EP_4x4mm_P0.8mm_EP2.5x3.6mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
